THERMAL PROPERTIES
The thermal properties are particularly favorable for wafers:
- Extremely low coefficient of thermal expansion
- Low thermal conductivity
- High thermal shock resistance
- Low specific heat
- High softening, strain and annealing points
Note: Low OH content fused quartz and dry fused silica can be subjected to higher processing temperatures up to 1100 C while higher OH content fused quartz and fused silica are limited to <950 C. If this is a critical issue then we will consult the manufacturer of the material.
Additional information on our quartz wafers: