Quartz Unlimited LLC.

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THERMAL PROPERTIES

The thermal properties are particularly favorable for wafers:

1. Extremely low coefficient of thermal expansion
2. Low thermal conductivity
3. High thermal shock resistance
4. Low specific heat
5. High softening, strain and annealing points

Note: Low OH content fused quartz and dry fused silica can be subjected to higher processing temperatures up to 1100 C while higher OH content fused quartz and fused silica are limited to <950 C. If this is a critical issue then we will consult the manufacturer of the material.

Additional information on our quartz wafers:

• SPECIFICATIONS
• MATERIAL GUIDE
• OPTICAL CHARACTERISTICS
• CHEMICAL PROPERTIES
• ELECTRICAL PROPERTIES
• MECHANICAL PROPERTIES
• THERMAL PROPERTIES
• WAFER CLEANING