THERMAL PROPERTIES

The thermal properties are particularly favorable for wafers:

  1. Extremely low coefficient of thermal expansion
  2. Low thermal conductivity
  3. High thermal shock resistance
  4. Low specific heat
  5. High softening, strain and annealing points

Note: Low OH content fused quartz and dry fused silica can be subjected to higher processing temperatures up to 1100 C while higher OH content fused quartz and fused silica are limited to <950 C. If this is a critical issue then we will consult the manufacturer of the material.

Additional information on our quartz wafers:

Supplying the semiconductor manufacturing industry with quartz wafers for over 25 years.

Highest Quality at Lowest Prices.

Need quick response, contact our
Sales Engineer: 561 865-6135 or ferenc@quartzunlimited.com

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